300nm Copper Nanoparticles

ʻO ka wehewehe pōkole:

Hoʻohana nui ʻia i ka pauka metallurgy, nā huahana kalapona uila, nā mea uila, nā uhi metala, nā catalysts kemika, nā kānana.


Huahana Huahana

300nm Cu Copper Submicron Powders

Hōʻike:

Code B036-1
Inoa Pauda Submicron Copper
Kumukumu Cu
CAS No. 7440-55-8
Ka nui o ka ʻāpana 300nm
Maʻemaʻe ʻāpana 99.9%
ʻAno Crystal pōʻai
Ka nana aku Paleka palaka
Pūʻolo 100g, 500g, 1kg a i ʻole e like me ka makemake
Nā noi kūpono

Hoʻohana nui ʻia i ka pauka metallurgy, nā huahana kalapona uila, nā mea uila, nā uhi metala, nā catalysts kemika, nā kānana, nā paipu wela a me nā ʻāpana electromechanical ʻē aʻe a me nā kahua mokulele uila.

wehewehe:

ʻOi aku ka hopena o ka Copper Submicron Powders me ka oxygen ma mua o ke keleawe maʻamau;Hōʻike nā Copper Submicron Powders i nā waiwai kemika ma mua o ke keleawe maʻamau, a ke hoʻololi nei i nā waiwai i manaʻo ʻia, akā ʻaʻole hoʻololi nā mea nano i ke kūlana o ka mea.

ʻAʻole wale ia, hana pololei nā Copper Submicron Powders ma ka ʻili metala o nā ʻāpana mīkini, a ke pāʻani nei i ka hana i ka hoʻoponopono ʻana i ka ʻili o ka metala.Ma hope o ka hoʻokuʻu ʻia ʻana o ka wela e ka friction, hiki i ka huahana ke hoʻohana i kāna mau nano-characteristics e hoʻopili ai i ka ʻili metala, e hana i ka ʻili o ka ʻili o ka metala maʻemaʻe, a me ka hoʻolaha ʻana i ke kiʻi pale i hana ʻia ma ka ʻili metala e ʻoi aku ka ikaika a me ka maʻalahi, pēlā. e hooloihi ana i ka metala o ka mīkini.ʻO ke ola lawelawe a me ka hopena mālama ola.

Kūlana mālama:

E mālama ʻia nā Copper Submicron Powders i kahi maloʻo, ʻoluʻolu, ʻaʻole pono e hōʻike ʻia i ka lewa e pale aku i ka anti-tide oxidation a me ka agglomeration.

SEM & XRD :

SEM keleawe nano particle 300nm XRD keleawe nano pauka


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