ʻO nā Nanoparticles Alloy Copper Ag-Cu no ka hoʻopili ʻana

ʻO ka wehewehe pōkole:

ʻO ka alloy Ag-Cu he conductivity uila kiʻekiʻe a me ke kūpaʻa oxidation.Hiki ke hoʻohana ʻia i loko o ka conductive paste no nā uila, nā kaʻa kaʻa kiʻekiʻe, nā ʻāpana hoʻokele kaʻa etc.


Huahana Huahana

ʻO Ag-Cu Kālā Copper Alloy Nanoparticles

Hōʻike:

inoa Nanoparticles huila keleawe kala
Kumukumu Ag-Cu
Ka nui o nā ʻāpana 20nm, 50nm, 80nm, 100nm, hiki ke hoʻololi
Maemae 99.9%+
Morphology aneane pōʻai
Ka nana aku ʻO ka maʻamau ʻeleʻele a ʻeleʻele paha ma muli o ke ʻano kālā
Nā noi kūpono Ka hoomakaukau ana i ka solder paste., etc.
No nā kikoʻī huahana hou aku, e ʻoluʻolu e kelepona mai iā mākou.

wehewehe:

Ke hoʻohana ʻia ka pauka alloy nano-silver-copper ma ke ʻano he conductive paste, hiki ke mālama ʻia ka nui o ke kālā, a he mea pono ia i ka mālama ʻana i ke kaiapuni.

Hoʻopili: Hoʻopiha piha ʻia, ʻeke pālua anti-static, 100g, 200g, 500g i loko o kahi ʻeke a i ʻole e like me ka makemake.

Kūlana mālama:

Pono e hoʻopaʻa ʻia nā nanoparticles alloy Ag-Cu ma lalo o ka momi a mālama ʻia i nā kūlana maloʻo a maloʻo.Pono e pale i ka pili ea.

SEM & XRD :

TG AGCU 750

  • Mua:
  • Aʻe:

  • E hoʻouna i kāu leka iā mākou:

    E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou

    E hoʻouna i kāu leka iā mākou:

    E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou