Idị isii nke thermal conductive nanomaterials na-ejikarị
1. Nano diomand
Diamond bụ ihe nwere conductivity thermal kacha elu na okike, yana ihe nrụpụta thermal ruo 2000 W / (mK) na ụlọ okpomọkụ, ọnụọgụ mgbasawanye thermal nke ihe dịka (0.86 ± 0.1) * 10-5 / K, yana mkpuchi n'ime ụlọ. okpomọkụ. Tụkwasị na nke ahụ, diamond nwekwara ọmarịcha ígwè ọrụ, ụda olu, ngwa anya, eletriki na kemịkal, nke na-eme ka ọ nwee uru doro anya na ikpochapụ ọkụ nke ngwaọrụ fotoelectric dị elu, nke na-egosikwa na diamond nwere nnukwu ngwa ngwa na-ekpo ọkụ ọkụ.
2. BN
Ọdịdị kristal nke hexahedral boron nitride yiri nke nhazi oyi akwa graphite.Ọ bụ ntụ ntụ na-acha ọcha nke a na-eji na-adịghị mma, lubricating, mfe absorption na ìhè arọ. Theoretical density bụ 2.29g / cm3, mohs hardness bụ 2, na chemical Njirimara bụ nnọọ stable.The ngwaahịa nwere nnukwu mmiri na-eguzogide na ike ga-eji na nitrogen ma ọ bụ. argon na okpomọkụ ruo 2800 ℃.Ọ bụghị nanị na ọ nwere ala thermal mgbasa ọnụọgụ, ma nwekwara a elu thermal conductivity, ọ bụghị nanị na a mma eduzi nke okpomọkụ, ma a ahụkarị eletriki insulator.The thermal conductivity nke BN bụ 730w / mk. na 300k.
3. SIC
Ihe onwunwe kemịkalụ nke silicon carbide kwụsiri ike, na conductivity thermal conductivity dị mma karịa ndị ọzọ semiconductor fillers, na thermal conductivity dị ọbụna karịa metal na ụlọ okpomọkụ. Ndị nchọpụta si Beijing University of Chemical Technology amụwo thermal conductivity nke alumina na silicon carbide. mesikwuru silicone rubber.The results na-egosi na thermal conductivity nke silicone roba na-abawanye na mmụba nke ego nke silicon carbide.With otu ego nke silicon carbide, thermal conductivity nke silicon roba mesikwuru na obere urughuru size bụ ukwuu karịa nnukwu urughuru size. .
4. ALN
Aluminom nitride bụ kristal atomic ma nwee ike ịdị n'otu n'otu na oke okpomọkụ nke 2200 ℃.N'ịbụ nke dị mma na-ekpo ọkụ na-ekpo ọkụ na obere ọnụọgụ nke mgbasawanye ọkụ, ọ bụ ihe mmetụta dị mma na-eguzogide okpomọkụ. The thermal conductivity nke aluminum nitride bụ 320 W · (m·K) -1, nke dị nso na thermal conductivity nke boron oxide na silicon carbide na ihe karịrị 5 ugboro nke alumina.
Ngwa ntụziaka: thermal silica gel system, thermal plastic system, thermal epoxy resin system, thermal seramiiki ngwaahịa.
5. AL2O3
Alumina bụ ụdị ihe nrụnye inorganic na-arụ ọrụ dị iche iche, nke nwere nnukwu ikuku thermal, dielectric na-adịgide adịgide na nguzogide ka mma, nke a na-ejikarị eme ihe na ihe mejupụtara rọba, dị ka gel silica, mkpuchi mkpuchi, epoxy resin, rọba, roba thermal conductivity, thermal conductivity plastic. , silicone griiz, ceramics dissipation okpomọkụ na ihe ndị ọzọ. Na ngwa bara uru, enwere ike iji ihe mkpuchi Al2O3 naanị ma ọ bụ jikọta ya na ihe ndị ọzọ dị ka AIN, BN, wdg.
6.Carbon Nanotubes
The thermal conductivity nke carbon nanotubes bụ 3000 W · (m·K) -1, 5 ugboro nke ọla kọpa. Carbon nanotubes nwere ike budata mma thermal conductivity, conductivity na anụ ahụ Njirimara nke roba, na ya ume na thermal conductivity dị mma karịa omenala. fillers dị ka carbon black, carbon fiber na glass fiber.