99.99% superfine micron flake conductive kala kala

Hōʻike oka pauka kala kalaiwa:

1. Nano nuipauda kala conductiver: 20nm / 30-50nm / 50-80nm, 99.99%, pōʻai.

2. Sub-micronpauda kala conductiver: 0.1um-1um hoʻopilikino mea OK

3. Micronpauda kala conductiver: 1-3um / 3-5um / 5-10um, kokoke spherical / flake

SEM a me COA oka pauka kala kalaiwa micron flakeloaʻa no kāu kuhikuhi.

ʻO Hongwu International ka hana ʻoihana nui mua o nā mea hana pauka kālā.ʻO ka pūʻulu o nā huahana he: nano antibacterial kala pauda, ​​conductive flake kala pauda, ​​ʻulaʻula kālā pauka, conductive ball kala pauda, ​​ultra-fine kala pauda, ​​oleic acid uhi ʻia nano kala pauda.

Aia nā hopena hoʻokolohua e hōʻike ana ua hoʻomākaukau ʻia ka paʻi kālā conductive composite ma ka hoʻohana ʻana i ka resin epoxy ma ke ʻano he mea hoʻohui, ka pauka kālā ultrafine e like me ka hoʻopiha conductive a me ka polyethylene glycol ma ke ʻano he mea hoʻohui.Loaʻa i ka pāpaʻi kālā nā ʻano o ka hiki ke ho'ōla ma ka lumi wela, ka conductivity kiʻekiʻe a me nā mea organik volatile kiʻekiʻe ma hope o ka hoʻōla ʻana, a hiki ke hoʻopili ʻia i nā ʻenehana uila i paʻi ʻia o ka inika conductive.

Koho ka pauda kala o ka mea hoʻohenehene polymer i hui ʻia1, pena conductiveNo ka hoʻopili conductive, ʻo ka pauka kālā i hoʻohui ʻia i nā ʻano kino kino a me nā waiwai kemika, ka absorption o ka aila, nā mea hoʻohui i luna, nā kala he mau ʻāpana koʻikoʻi.2, hoʻopili conductiveMa ka RFID nano-silver powder dispersion, electromagnetic shielding a me nā koi ʻē aʻe o ka haʻahaʻa haʻahaʻa e hoʻomaloʻo wikiwiki i ka slurry (ka mahana maloʻo <120 ℃, ka manawa maloʻo <20min), pono ke koho ʻia ke kālā kiʻekiʻe.ʻO ka pauka kala kala.No ka mahana maloʻo a me ka manawa i ka 130 ℃ ~ 140 ℃ / 30min ~ 40min polymer conductive paste.Maikaʻi kālā haʻahaʻa (<50 wt%)Pono e koho ʻia ka moʻo kālā flake.Pono e hoʻohana ʻia ka maʻiʻo kālā liʻiliʻi (50-60wt%) i ka pauka kala ʻulaʻula, ka hoʻomaloʻo ʻana i ke kiʻiʻoniʻoni a me ka pili ʻana ma muli o ke kiʻi maloʻo.Layer o ke kala a me ka resin i ka leo lākiō a me ka shrinkage, no laila e noonoo i ka huina kala a me ka resin kaumaha lākiō hoʻololi.3, hoʻopili conductiveʻO ka pauka kala ka mea nui o ka conductive adhesive, e pili ana i ke kaʻina hana adhesive conductive (rheology, thixotropy, fineness, curing condition, etc.).Hua ho'ōlaNā waiwai kino a me ke kemika (conductivity, thermal conductivity, adhesion strength);ho'ōla i ka hilinaʻi mea (wela a humid, kiʻekiʻe a haʻahaʻa ka hopena wela).

Hoʻopili i ka pauka kālā conductive: ʻeke ʻeke anti-static pālua a i ʻole pahu

lawelawe o ka pauka kala kalaiwa micron flake

ʻIkepili hui oka pauka kala kalaiwa micron flake:

ʻO Guangzhou Hongwu Material Technology Co., ʻo ia kahi Hui Nanotechnology e hana ana i nā nanoparticles mai 2002, no ka ʻoi aku o 15 makahiki, ke hoʻomau nei mākou i ka hoʻomohala ʻana i nā nanomaterial hou e pili ana i nā noi no ka ʻoihana a me ka nui o ka nui o ka nui a mākou e hāʻawi nei he 10nm-10um.

Hiki iā mākou ke hana i nā nanomaterials i nā koi kūikawā o ka custmer, me ka nui o ka nui o ka ʻāpana kūikawā, ka hoʻopuehu, ka uhi ʻana, nā hoʻololi o ka ʻili, SSA kūikawā, AD, koi etc.

ʻO ka pauka kala kekahi o kā mākou huahana pono loa, ua holomua mākou a paʻa i ke kaʻina hana a me ka ʻenehana, a loaʻa iā mākou ka mana maikaʻi i ka nui.

Hāʻawi mau ʻia ka maikaʻi maikaʻi, ke kumukūʻai hale hana a me ka lawelawe ʻoihana no ka hui lanakila-lanakila lōʻihi!