Conductive Ag i uhi ʻia ʻo Cu Powder Micron Silver Coated Copper Powder no ka Conductive Filler
Hua'ōlelo Spec
| inoa mea | Pauda keleawe i uhi ʻia i ke kālā |
| MF | Ag-Cu |
| Maʻemaʻe(%) | 99.9% |
| ʻO ke ʻano | Powder |
| Nui ʻāpana | 1-3um, 5um, 8um |
| ʻAno aniani | NA |
| Hoʻopili ʻia | 1kg no ka ʻeke |
| Papa Kūlana | Papa Hana Hana,Papa Elekona |
Hana Huahana
Palapala noioPauda keleawe i uhi ʻia i ke kālā:
1. Hoʻopili paʻa.
2. Nā uhi hoʻokele.
3. Polimer.
4. Hoʻopili paʻa.
5. Ke alakaʻi nei i nā pono electrostatic o ka ʻenehana microelectronics, ʻo ka mea conductive e like me ka mālama ʻana i ka metala, e like me ka ʻoihana, he ʻano hou o nā pauka hoʻohuihui conductive.
6. Electronics.
7. ʻOihana koa a me nā wahi ʻoihana ʻē aʻe o ka pale conductive a me ka electromagnetic.
8. ʻO nā kamepiula, kelepona kelepona, kaʻapuni i hoʻohui ʻia, nā ʻano mea uila a pau, nā mea lapaʻau uila, nā mea uila a me nā mika, a me nā mea ʻē aʻe, ʻaʻole i hoʻopaʻa ʻia ka huahana i ka interference electromagnetic.
WaihonaoPauda keleawe i uhi ʻia i ke kālā:
Ka pauda keleawe i uhi ʻiarpono e hoʻopaʻa ʻia a mālama ʻia i loko o kahi wahi maloʻo maloʻo, mamao mai ka lā pololei.
