Hāʻawi i ka hale hana Copper Cu Powder, Copper Nanoparticle

Hōʻike huahana

ʻO ka paukū keleawe kikoʻī:

ʻO kā mākou mau huahana pauka keleawe me: nano sphericalcopper pauka, ultrafine copper pauka, micron copper pauka, micron copper pauka he ʻekolu ʻano: spherical, flake, dendritic.

Nā noi o ka pauka keleawe:

1. Micron spherical copper pauka: maikaʻi loa ka degere spherical, hoʻohana nui ʻia i ka pauka metallurgy, nā huahana kalapona, nā mea uila, ka uhi metala, ka mea hoʻoheheʻe kemika, kānana, paipu wela a me nā ʻāpana mechanical a me nā uila a me nā kahua mokulele uila.

2. Micron dendritic keleawe pauka: maʻalahi e oxidize i ka moist ea, hiki ke hoʻoheheʻe i ka wela sulfuric acid a nitric acid.With kiʻekiʻe ili hana a me ka maikaʻi conductivity a me ka thermal conductivity, he mea koʻikoʻi ʻoihana maka, hoʻohana nui ʻia i ka pauka metallurgy, catalyst, lubricant, conductive coating a me nā mea pale electromagnetic a me nā kahua ʻē aʻe.

3. Micron flake keleawe pauka: he maemae ka helehelena, ke kala like, ke keleawe ulaula flake metala pauka, hiki ke pani i kekahi hapa kala pauda e hoomakaukau i ka haʻahaʻa wela polymer conductor, conductive adhesive, etc., hiki no hoi ke hana i conductive, electromagnetic pale, anti. -static products.Mainly hoʻohana 'ia ma ka uila, lubrication mea, kamaʻilio 'enekinia, machinery manufacturing, na mea hana, elekene nā mea, hale a me nā mea 'ē aʻe kahua, nui hoemi i ka hana koina. ka pauda keleawe i uhi ʻia i ke kālā me nā manaʻo hoʻohana ākea.

4. Nano keleawe pauka: nui spherical pauka me ka maikai sphericity.Main noi, metala nano-lubricating mea hoʻohui, ili conductive uhi lapaʻau o ka metala a me ka non-metala, kiʻekiʻe ka pono catalyst, conductive slurry, maka mea no ka bulk metala nano-mea, nano. -metala hoʻoponopono ponoʻī.