99% spherical 20nm koporo nanopowder BTA e koahetsoeng ke Cu nanoparticles

Tlhaloso ea Sehlahisoa

SEM Setšoantšo, COA le MSDS ofnano matla a koporo a fumaneha bakeng sa litšupiso tsa bareki.

Kaha 20nm Cu copper nano powder e sebetsa haholo, re etsa BTA coating.Haeba moreki a na le kalafo e 'ngoe ea holim'a metsi a hloka ho amoheloa ho botsa, kea leboha.

40nm, 99%, chitja

70nm, 100nm, 200nm, 99.9%, chitja

Copper sub-micron size le micron size koporo flaks / chitja, amohelehile ho botsa

Hape bakeng sa phofo ea ultrafine Cu, re fana ka phofo e metsi e neng e na le palo e itseng ea metsi a deionized.

Kopo eaHo na le nanoparticles:

Ka lebaka la thepa ea eona e ikhethang ea 'mele le lik'hemik'hale le ts'ebeliso ea eona e pharaletseng masimong a optics, elektronike, catalysis, antibacterial, lubrication, ho tlatsa polymer le phetoho, tlhokomelo e eketsehileng e lefshoa ho eona.

Metal nano-lubrication additives: Ho kenyelletsa 0.1 ~ 0.6% ho oli e tlotsang le mafura, nakong ea ts'ebetso ea likhohlano, bokaholimo ba likhohlano bo tla theha filimi e itlhoekisang le e itokisang, e ntlafatsang haholo ts'ebetso ea anti-friction. para ea khohlano.

Metal le non-metallic surface conductive coating treatment: Nano-aluminium, koporo le nickel powders li na le libaka tse sebetsang haholo, 'me liphahlo li ka sebelisoa ka mocheso o ka tlaase ho sebaka sa ho qhibiliha ha phofo tlas'a maemo a se nang oksijene.Theknoloji ena e ka sebelisoa ho hlahisa lisebelisoa tsa microelectronic.

Lisebelisoa tse sebetsang hantle haholo: Koporo le li-nano-powder tsa alloy li sebelisoa e le li-catalyst, tse nang le ts'ebetso e phahameng le khetho e matla, 'me li ka sebelisoa e le li-catalysts karabelong ea carbon dioxide le hydrogen ho methanol.