Bakeng sa pente e tsamaisang Nano Copper Powder ( Cu nanoparticles )

Tlhaloso e Khutšoanyane:


Lintlha tsa Sehlahisoa

Nano Copper Powder ( Cu nanoparticles )

Tlhaloso ea Sehlahisoa
Lebitso la sehlahisoaLitlhaloso
Nano Copper Powder ( Cu nanoparticles )

MF: Ho

Nomoro ea CAS: 7440-50-8

Mmala: o motsho

Boholo ba likarolo: 100nm

Bohloeki: 99.9%

Morphology: chitja

MOQ: 100g

Tšebeliso ea Nano Copper Powder ( Cu nanoparticles )

Li-terminals le li-electrode tse ka hare tsa MLCC li entsoe ka lisebelisoa tse nyane tsa elektroniki.Ka mefuta e meng ea eona ho lokisoa ha phofo e ntle ea tšepe, ts'ebetso e ntle haholo ea slurry ea elektroniki, e ka fokotsa litšenyehelo haholo, ea ntlafatsa ts'ebetso ea microelectronics.

Packaging & ShippingSephutheloana saNano Copper Powder: ka mekotleng e habeli ea anti-static, meropa.sephutheloana se tloaelehileng 100g / mokotla, 500g / mokotla, 1kg / mokotla joalo-joalo, le sephutheloana se ka etsoa joalo ka litlhoko tsa bareki.

Thomello bakeng saNano Copper Powder: EMS, Fedex, DHL, TNT, UPS, mela e khethehileng, joalo-joalo, ho tsamaisa moea joalo-joalo.

Delivery: Mohlala oa setoko se rometsoeng nakong ea matsatsi a 3 a ts'ebetso ha ho netefalitsoe, Express hangata e nka matsatsi a 3-5 ho fihla linaheng tseo u eang ho tsona.

Litšebeletso tsa Rōna

1. Araba ka potlako lipotso, melaetsa le mangolo-tsoibila, nakong ea lihora tse 24.

2. Iketsetse tšebeletso ho ba le thepa ea nano, thepa ea micron ka boholo ba likaroloana tsa hau tse hlokahalang, solvent OK.

3. Fektheri theko e ntle.

4. Tšehetso ea litsebi.

5. Ho tsamaisoa ka potlako

Lintlha tsa Khampani

HW material Technology e etsa lisebelisoa tsa nano ho bareki ba rona ba lefats'e ho tloha ka 2002, 'me re na le theknoloji e tsoetseng pele ea tlhahiso le taolo e tiileng ea boleng.Joaloka moetsi le mofani oa thepa, re fana ka lihlahisoa tsa boleng, theko ea tlhōlisano le tšebeletso ea litsebi.

Lisebelisoa tsa HW li fanoa ka boholo ba karolo ea 10nm-10um, kaha phofo ea koporo e sebelisoa haholo libakeng tse fapaneng, re na le boholo ba likaroloana tsa manu bakeng sa khetho ea bareki le ho etsa tšebeletso ea hau ka tsela e nepahetseng.

nano phofo ea koporo: 20nm, 40nm, 70nm, 100nm, 200nm

sub-micron koporo phofo: 0.3um, 0.5u, 0.8um

micron flake phofo ea koporo: 1-2um, 3um, 5-6um, 7-8um

Rea u amohela ho botsa.

LBH

1. Na u na le boholo ba likaroloana tse lingNano Copper Powder ( Cu nanoparticles )ka tlhahiso?

Ee, 20nm, 40nm, 70nm, 200nmare e fumaneha, hape u iketsetse 8-20um e lokile ha o e hloka.

2.Na nka ba le sampuli ea nano phofo ea koporo pele?

Ee, mohlala oa odara oa fumaneha, amohela potso ea hau.

3.Ho nka nako e kae ho fihla ka mor'a ho netefatsa taelo ea phofo ea koporo ea nano?

Ho romelloa ho hlophisoa kapele ho netefatsa tefo, 'me ho nka matsatsi a 3 ~ 6 ho fihla.

4.Nako ea tefo ke efe?

T/T, Western Union, Paypal, hape odara ka Alibaba TradeAssurance e lokile.

5. Na o ka romela setšoantšo sa SEM sa phofo ea hau ea koporo ea nano bakeng sa boitsebiso?

E, SEM, COA le MSDS lia fumaneha.


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