Ke hoʻohana nei ka huila wili daimana i ka abrasive daimana ma ke ʻano he mea maka, a hoʻohana i ka pauka metala, ka pauka resin, nā seramika a me nā metala electroplated e like me nā mea paʻa.Ua kapa ʻia ka huila wili daimana (alloy grinding wheel) ka mea hana abrasive i hoʻopaʻa ʻia me ka puka ma waena.

He haʻahaʻa ke ola o ka huila daimana i hoʻopaʻa ʻia i ka resin a ʻaʻole hiki ke hoʻokō i nā koi o nā mea hana mīkini hoʻokele helu kiʻekiʻe.ʻO ke ola pōkole ma muli o ka maikaʻi ʻole o ka pale ʻana o ka resin bond a i ʻole ka haʻahaʻa haʻahaʻa o ka paʻa ʻana i ka daimana, kahi e hāʻule mua ai nā ʻāpana abrasive daimana i ka wā o ka wili.No laila, pehea e hoʻomaikaʻi ai i ka pale ʻana o ka resin bond a me ka hoʻomaikaʻi ʻana i ka ikaika paʻa o ka resin ma ka daimana i lilo i kī i ka hoʻomaikaʻi ʻana i ke ola lawelawe o ka resin bond diamond grinding wheel.

ʻO ka hoʻohui ʻana i nā ʻūhā silicon carbide hiki ke hoʻomaikaʻi nui i ka ikaika, ka paʻakikī, ka pale ʻana i ka wela, ka polishing, etc. o ka mea paʻa a me ka huila wili.Loaʻa i nā whiskers Silicon carbide nā waiwai mechanical a physicochemical e like me ka paʻakikī kiʻekiʻe, ka ikaika kiʻekiʻe (ka paʻakikī), a me ke kūpaʻa maikaʻi loa, no laila ua hoʻohana nui ʻia lākou i nā metala, keramika, plastics, etc.

ʻO ka hoʻoikaika a me ka paʻakikī o nā mea a me nā mea hoʻohui e hoʻomaikaʻi i ka ikaika o nā mea hoʻohui a pale aku i ka emi a me ka deformation.ʻO ke ʻano o nā ʻumiʻumi silika carbide ua like ia me nā nila, ʻoi aku ka nui o kona paʻakikī Webster kokoke i ke daimana a he maikaʻi ka paʻakikī a me ke kūpaʻa ʻana, a hoʻohālikelike ʻia me nā ʻōpala abrasive, ʻoiai ʻo ke anawaena e like me ka nui o ka palaoa abrasive, aia nā ʻūhā. o kekahi lōʻihi i hui pū ʻia me ʻO ka mea hana he wahi hoʻopaʻa nui a me ka ikaika hoʻopaʻa ʻana, kahi e hoʻomaikaʻi nui ai i ke ola lawelawe o ka huila wili.

ʻO ka β-type micron-nuiʻumiʻumi kalapona silikahana ʻia e Hongwu Nano nā hiʻohiʻona o ka maʻemaʻe kiʻekiʻe a me ka morphology maikaʻi, a ʻo ia nā mea i makemake ʻia no ka hoʻoikaika ʻana a me ka paʻakikī o nā ʻano mea metala like ʻole, ka keramika a me ka resin-based composite.ʻAʻole hoʻohālikelike ʻia kona hopena hoʻoikaika a paʻakikī a me ka laulā o ka hoʻohana ʻana e nā mea ʻē aʻe.

ʻO nā ʻumi ʻumi kilikakika beta he mau aniani hoʻokahi e like me ka nila.Ma keʻano he aniani atomika, he haʻahaʻa haʻahaʻa, he mea hoʻoheheʻe kiʻekiʻe, ikaika kiʻekiʻe, modulus kiʻekiʻe, haʻahaʻa haʻahaʻa haʻahaʻa hoʻonui, a me nā hiʻohiʻona maikaʻi loa e like me ke kūpaʻa ʻana, ke kūpaʻa corrosion, ke kūpaʻa wela kiʻekiʻe, ke kūpaʻa oxidation, etc. kumu metala, kumu seramika , Hoʻoikaika a paʻakikī i nā mea i hoʻopaʻa ʻia i ka resin, e hoʻomaikaʻi nui i nā waiwai o nā mea hana.

ʻO kāna mau hōʻailona hana kino nui penei:

Anawaena Whisker: 0.1-2.5um

Ka lōʻihi o ka Whisker: 10-50um

Māmā: 3.2g/cm2

Paʻakiki: 9.5 Mobs

Modulus Modulus: 480GPa

Ka ikaika o ka hoʻonui: 20.8Gpa

ʻO ka mahana kūpono: 2960 ℃

Inā makemake ʻoe, e ʻoluʻolu e kelepona iā mākou no ke aʻo ʻana e pili ana i ka kikoʻī o HONGWU sic whikser a i ʻole sic nanowires.