Ag-Cu Silver Copper Alloy Nanoparticles bakeng sa Conductive Paste
Ag-Cu Silver Copper Alloy Nanoparticles
Tlhaloso:
| Lebitso | Silver Copper Alloy Nanoparticles |
| Foromo | Ag-Cu |
| Boholo ba likaroloana | 20nm, 50nm, 80nm, 100nm, e ka fetolehang |
| Bohloeki | 99.9%+ |
| Morphology | e batlang e le chitja |
| Ponahalo | Ka kakaretso e 'mala o motšo kapa o bosootho ho latela boemo ba silevera |
| Lisebelisoa tse ka bang teng | Ho lokisoa ha solder paste., joalo-joalo. Bakeng sa lintlha tse ling tsa sehlahisoa, ka kopo ikopanye le rona ka bolokolohi. |
Tlhaloso:
Ha nano-silver-copper alloy powder e sebelisoa e le sekontiri sa conductive, chelete ea silevera e ka bolokeha, 'me e molemo ho sireletsa tikoloho.
Packing: Vacuum-packed, mokotla oa anti-static o habeli, 100g, 200g, 500g ka mokotleng kapa kamoo ho hlokahalang
Boemo ba polokelo:
Ag-Cu alloy nanoparticles e lokela ho koaloa ka tlas'a vacuum 'me e lokela ho bolokoa maemong a pholileng le a omileng.Ho kopana le moea ho lokela ho qojoa.
SEM & XRD :
Re romelle molaetsa oa hau:
Ngola molaetsa wa hao mona mme o re romele wona
