Me yasa za'a iya amfani da foda na silicon dioxide nano don CMP?

Nano-silica yana da in mun gwada da low cost, andgood dispersibility, inji abrasion, high ƙarfi da kuma mannewa, mai kyau film samuwar, high permeability, high weather da lalacewa juriya, kananan barbashi size, taurin.Hakanan yana da fa'idodin matsakaici, ƙarancin danko, ƙarancin mannewa, da sauƙin tsaftacewa bayan gogewa.Don haka abu ne mai gogewa don fasahar CMP tare da kyakkyawan aiki.

SiO2 nano barbashi sau da yawa ana amfani da daidai polishing na karfe, sapphire, monocrystalline silicon, gilashin-ceramics, haske jagora tube da sauran saman.Girman nano silicon oxide yana ƙasa da 100nm, wanda ke da ƙayyadaddun yanki na musamman, babban tarwatsawa da haɓakawa, don haka lalacewar Layer akan farfajiyar kayan aikin gogewa yana da ƙanƙanta;Bugu da kari, taurin silica nanoparticle yayi kama da na siliki wafers.Sabili da haka, ana amfani da shi sau da yawa don polishing semiconductor silicon wafers.

Amfanin nano SiO2 foda a cikin aikace-aikacen CMP:

1. gogewa shine yin amfani da nau'ikan nanoparticles na SiO2 da sauran kayan, wanda ba zai haifar da lalacewar jiki ga sassan da aka sarrafa ba, kuma saurin yana da sauri.Yin amfani da barbashi irin su colloidal silica tare da uniform da girman girman barbashi na iya cimma manufar polishing mai sauri.

2. Ba ya lalata kayan aiki kuma yana da babban aikin aminci.

3. Cimma high flatness nika aiki.

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