Sei silicon dioxide nano poda inogona kushandiswa CMP?

Nano-silica ine mutengo wakaderera, uye yakanaka dispersibility, mechanical abrasion, yakakwirira simba uye adhesion, yakanaka firimu kuumbwa, yakakwirira permeability, yakakwirira mamiriro ekunze uye kupfeka kuramba, duku particle size, kuoma.Iyo ine zvakare zvakanakira zvepakati, yakaderera viscosity, yakaderera adhesion, uye nyore kuchenesa mushure mekupukuta.Saka chinhu chekupukuta che CMP tekinoroji nekuita kwakanaka.

SiO2 nano particle inowanzo shandiswa kunyatsokwenenzverwa kwesimbi, safiro, monocrystalline silicon, girazi-ceramics, light guide chubhu uye mamwe maficha.Saizi ye nano silicon oxide iri pazasi 100nm, iyo ine yakakura chaiyo nzvimbo, yakakwira dispersibility uye permeability, saka iyo yekukuvadza layer iri pamusoro peyakakwenenzverwa workpiece idiki zvakanyanya;uyezve, kuoma kwesilica nanoparticle kwakafanana neiyo yesilicon wafers.Naizvozvo, inowanzoshandiswawo kupukuta semiconductor silicon wafers.

Zvakanakira nano SiO2 poda muCMP application:

1. Kuchenesa ndiko kushandiswa kweyunifomu nanoparticles yeSiO2 nezvimwe zvinhu, izvo zvisingazokonzeri kukanganisa kwemuviri kune zvikamu zvakagadziriswa, uye kukurumidza kunokurumidza.Kushandiswa kwezvimedu senge colloidal silica ine yunifomu uye yakakura particle size inogona kuzadzisa chinangwa chepamusoro-kumhanya kupenya.

2. Haisi kukanganisa midziyo uye ine kuchengetedzwa kwepamusoro.

3. Kuwana yakakwirira flatness grinding processing.

4. Kunyatso dzikisa kukwenya kwepamusoro mushure mekupenya uye kuderedza kushata kwepamusoro mushure mekupenya.