Vim li cas silicon dioxide nano hmoov tuaj yeem siv rau CMP?

Nano-silica muaj tus nqi qis, thiab zoo dispersibility, mechanical abrasion, siab zog thiab adhesion, zoo zaj duab xis tsim, siab permeability, siab huab cua thiab hnav tsis kam, me me particle loj, hardness.Nws kuj muaj qhov zoo ntawm qhov nruab nrab, tsis muaj viscosity, tsis muaj adhesion, thiab yooj yim tu tom qab polishing.Yog li nws yog cov khoom siv polishing rau CMP thev naus laus zis nrog kev ua tau zoo heev.

SiO2 nano particle feem ntau yog siv rau precision polishing ntawm hlau, sapphire, monocrystalline silicon, iav-ceramics, lub teeb qhia raj thiab lwm qhov chaw.Qhov loj ntawm nano silicon oxide yog qis dua 100nm, uas muaj thaj chaw loj tshwj xeeb, siab dispersibility thiab permeability, yog li txheej kev puas tsuaj ntawm qhov chaw ntawm polished workpiece yog me me;Tsis tas li ntawd, lub hardness ntawm silica nanoparticle zoo ib yam li cov silicon wafers.Yog li ntawd, nws kuj yog feem ntau siv rau polishing semiconductor silicon wafers.

Qhov zoo ntawm nano SiO2 hmoov hauv CMP daim ntawv thov:

1. Polishing yog siv cov khoom siv nanoparticles ntawm SiO2 thiab lwm yam khoom siv, uas yuav tsis ua rau lub cev puas tsuaj rau cov txheej txheem ua haujlwm, thiab qhov nrawm nrawm.Kev siv cov khoom xws li colloidal silica nrog cov qauv thiab cov khoom loj loj tuaj yeem ua tiav lub hom phiaj ntawm kev kub ceev polishing.

2. Nws tsis corrode cov cuab yeej thiab muaj kev ruaj ntseg zoo.

3. Ua tau siab flatness sib tsoo ua.

4. Ua tau zoo txo ​​qhov khawb qhov chaw tom qab polishing thiab txo qhov roughness tom qab polishing.